Four cubes, three dies, two attaches, one QoS plane.
First Stallion package is four partner cubes on a CoWoS-class silicon interposer. Gallium-HX is its own chiplet. Six- and eight-cube SKUs are later memory-slot re-locks, not a second GPU bandwidth.
Flagship attach. Gallium-HX is a separate chiplet. Cubes are partner DRAM stacks. UCIe never carries HBM beats.
Host / I/OStallionGallium + cubes
Mixing these identities is the modern “PHY inside the ARM core” mistake. Aggregate TB/s is owned only by Gallium.
Three physically distinct attaches. Mixing their identities is forbidden.
Path
Protocol
Payload
Identity owner
Host ↔ I/O die
PCIe 6.0 x16 / CXL 3.1
Commands, page traffic, pooling
I/O die
I/O ↔ Stallion
UCIe-E
MMIO, interrupts, sidecar
I/O die
Stallion ↔ Gallium sidecar
UCIe-E or on-die APB
Credit, refresh hints, thermal, RAS
Sidecar
Stallion L2 ↔ cubes
JESD270-4 or JESD330-4
All HBM data
Gallium memory lock
Dual-mode changes PHY-IF width and serialization only. The credit plane, remap, RAS, and hint ports stay the same.Per-channel independence is a JEDEC property. Cross-channel stalls are legal only for cube-level refresh, thermal, and RAS.Dual-mode mux changes pin muxing, not credit counters. Bank-conflict timing stays packed or empty — never invented.Class 3 requests a Stallion clock re-lock. It is not a silent Vdd change and not a numeric Tj max.
Encoding-naive PCIe is not HBM
PCIe Gen6 x16 is 16 × 64 / 8 = 128 GB/s raw, and lower after FLIT. It must never appear in the same sentence as Gallium TB/s without an explicit “different attach” clause.