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Technical Research & Whitepapers

Architectural Insights & Frontier Silicon Diligence.

Architecture notes and commentary. Family numbers such as 2nm-class and 16.0 TB/s Gallium HBM4 are TARGET / NOT MEASURED. Bring-up silicon targeted 1H 2027 · Product S10 2H 2027.

Distributed AI Systems, Pre-Training & Hardware Architecture•August 2026•7 min read

Scaling Frontier Model Pre-Training: Why 3Dx3D Glass Core Silicon Solves the 11 TB Optimizer Wall & MoE All-to-All Bottleneck

Frontier model pre-training chokes on the 11.2 TB AdamW optimizer wall and MoE All-to-All network saturation. An architectural breakdown of how 512 GB Gallium HBM4 sockets and FV-Link Co-Packaged Glass Photonics eliminate ZeRO-3 offload stalls.

#Frontier Pre-Training#11.2 TB Optimizer#FV-Link CPO#512 GB Gallium HBM4#Glass Core CTE#BSPDN Power
Fairview Architecture Team
Distributed Systems & Silicon Infrastructure
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Commentary · Not a datasheet•September 2026•6 min read

Reading FreeToken: The Residual Memory Problem, and the Stallion S10

FreeToken is other people’s software (arXiv:2608.16157). It does not run on Stallion today. A reading of q*, elastic cache, and checkpoints — then the residual on-prem memory problem and the intended S10 answer (bring-up 1H 2027 · product 2H 2027).

#FreeToken commentary#arXiv:2608.16157#S10 2H 2027#On-prem inference#TARGET / NOT MEASURED
Fairview Semiconductor
Commentary
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Silicon Architecture & Systems Design•August 2026•10 min read

Inside the Stallion MPU: Eradicating the GPU "Graphics Tax" for 4.72 PFLOPS of 2nm Systolic Compute

A deep dive into the 144 MEU topology, Backside Power Delivery (BSPDN), and why pureplay systolic MPUs outperform general-purpose GPUs without graphics die bloat or thermal IR voltage droop.

#2nm GAAFET#144 MEU Array#BSPDN SuperPower#Systolic Tensor#4.72 PFLOPS#PULSE MLIR
Srikanth Rao
Founder & Chief Architect
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Hardware Architecture & Advanced Packaging•August 2026•12 min read

Breaking the Silicon Ceiling: Glass Core Substrates, Bumpless Hybrid Bonding, and Co-Packaged Optics in the Post-GPU Era

The fundamental bottleneck of AI is no longer raw compute density—it is the Thermodynamic Triad. An in-depth architectural breakdown of how Glass Core Substrates, TSMC-SoIC Direct Cu-Cu Hybrid Bonding, Backside Power Delivery (BSPDN), and Co-Packaged Optics (CPO) break the memory wall.

#Glass Substrates#Direct Cu-Cu Bonding#BSPDN#CPO#2nm GAAFET#HBM4
Srikanth Rao
Founder & Chief Architect
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Upcoming Research Dispatches

Memory Subsystem Engineering•Coming Soon · Q3 2026

Deterministic Sub-8ns Micro-Arbiter Latency in 16,384-Bit HBM4 Memory Fabrics

How FairView’s hardware arbiter balances 32 concurrent pseudo-channels without bank conflicts or queue starvation under saturated multi-head attention traffic.

#HBM4#Micro-Arbiter#SECDED ECC#Logic MMU
Author: FairView Architecture Team
Systems & Software Co-Design•Coming Soon · Q3 2026

PULSEâ„¢ Runtime: Bypassing Host CPU SerDes Bottlenecks in Hyperscaler Clusters

A technical analysis of zero-copy CXL 3.1 memory pooling, Tokio async streaming, and Kubernetes Device Plugin orchestration across 512-MPU coherent domains.

#PULSE SDK#CXL 3.1#Kubernetes#Rust#Triton
Author: PULSE Software Engineering
FairView Semiconductor — Stallion AI MPU & Gallium HBM4