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Fairview Semiconductor
Enterprise Systems · 2028

1U, 2U & 3U High-Density Blade Servers.

Turnkey enterprise rack infrastructure for on-prem and sovereign inference. Target (product family) aggregate memory bandwidth and cooling envelopes below. Caption: 2028 systems.

Technical discussion ›Inspect Engineering Datasheets
FairView FV-RACK Series datacenter rack infrastructure
FairView Infrastructure · 2027 Deployment

FV-RACK Series Hardware Matrix

Unified MPU compute dies and 16,384-bit HBM4 memory architecture scaled for enterprise hyperscale deployments.

Chassis Form Factors

Modular AI Supercomputing Nodes.

Choose the optimal form factor for inference density, foundation training, or rack-scale immersion clusters.

1UEdge & High-Density Inference

FV-RACK-1U "Apex"

Sub-millisecond inference serving, low-latency financial models, and distributed edge clusters.

Aggregate Memory Bandwidth
32.768 TB/s
Compute4× Stallion S80I Accelerated Modules
Memory576 GB HBM4
CoolingHigh-Static Pressure Air Cooling
NetworkingDual 800GbE OSFP (1.6 Tbps Total)
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Flagship
2UEnterprise AI & Frontier LLM Training

FV-RACK-2U "Sovereign"

Turnkey foundational training node, massive multi-modal embedding generation, and high-throughput LLM clusters.

Aggregate Memory Bandwidth
65.536 TB/s
Compute8× Stallion S80I Accelerated Modules
Memory1,152 GB (1.15 TB) HBM4
CoolingDirect-to-Chip Liquid Cooling Cold Plates
NetworkingQuad 800GbE OSFP (3.2 Tbps Total)
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3USupercomputing & MoE Clustering

FV-RACK-3U "Megascale"

Megascale trillion-parameter training pods and high-performance tensor computing arrays.

Aggregate Memory Bandwidth
131.072 TB/s
Compute16× Stallion S80I Accelerated Modules
Memory2,304 GB (2.30 TB) HBM4
CoolingFull Submerged Liquid Immersion Chassis
NetworkingOctal 800GbE OSFP (6.4 Tbps Total)
Request 3U Allocation ›
Engineering Comparison

Comparative Blade Specifications Matrix.

Technical FeatureFV-RACK-1UFV-RACK-2U (Flagship)FV-RACK-3U
Target WorkloadHigh-Density InferenceEnterprise Foundation TrainingMegascale Pre-Training & Supercomputing
Compute Density4× Stallion S80I Nodes8× Stallion S80I Nodes16× Stallion S80I Nodes
Unified HBM4 Memory576 GB High-Bandwidth1,152 GB (1.15 TB)2,304 GB (2.30 TB)
Aggregate Memory Bandwidth32.768 TB/s65.536 TB/s131.072 TB/s
Sparse FP8 Tensor Compute3.78 PFLOPS7.55 PFLOPS15.10 PFLOPS
Host Interface & Memory PoolingDual PCIe 6 + CXL 3.1Quad PCIe 6 + CXL 3.1Octal PCIe 6 + CXL 3.1
Inter-Rack Scale-Up NetworkDual 800GbE OSFP (1.6 Tbps)Quad 800GbE OSFP (3.2 Tbps)Octal 800GbE OSFP (6.4 Tbps)
Thermal Dissipation MethodHigh-Static Pressure AirDirect-to-Chip Liquid Cold PlateFull Liquid Immersion Pod
Power Supply Configuration2.8 kW (80+ Titanium)5.6 kW (80+ Titanium)11.2 kW (N+N Redundant)
Delivery Target2028 Systems2028 Systems2028 Systems
Regulated Microverticals

Purpose-Built for Sovereign & Enterprise Infrastructure.

Delivering dedicated, high-efficiency compute platforms tailored for regulated banking, sovereign national security, and high-availability enterprise infrastructure.

Regulated Banking (BFSI)

Algorithmic Trade Surveillance & Sovereign Core-Banking LLMs

Ultra-low latency, deterministic inference for algorithmic trade surveillance, AML monitoring, and sovereign core-banking LLMs executing directly on-premise without third-party API exposure.

BFSI MicroverticalDeterministic LatencyOn-Prem PII Compliance350W Air-Cooled
Request Engineering Attachment Specs for Regulated Banking (BFSI) →
Deterministic Inference Latency
< 1.2 ms
Compliance StandardAir-Gapped On-Premise PII Residency
Inference Latency< 1.2 ms (Zero-Jitter Execution)
Thermal Envelope350W Air-Cooled Standard Server Rack
Workload FocusAgentic LLMs & High-Frequency Risk Models
OEM Early Access & Allocation

Secure 2027 Production Blade Allocations.

Reserve hardware evaluation slots for 1U, 2U, or 3U blade servers. Direct engineering engagement for custom power envelopes, liquid cooling manifolds, and PCIe Gen6/CXL 3.1 host topology.

Submit Design-In Allocation ›Request Technical Datasheet
FairView Semiconductor — Stallion AI MPU & Gallium HBM4