Purpose-built AI silicon. Series A.
Stallion and Gallium are Fairview’s compute and memory families for on-prem and sovereign inference. Operating from Santa Clara, California, USA and Hyderabad, Telangana, India.
The Pillars of Silicon Supremacy.
How FairView redefines compute density, memory bandwidth, and 700W thermal packaging for foundation model scale.
Monolithic 2nm GAAFET (TSMC N2) Compute Core
185 billion monolithic transistors fabricated on TSMC’s premier N2P GAAFET platform, delivering 4.72 PFLOPS of sustained FP8 throughput with native transformer hardware micro-scaling engines and zero NUMA hop penalties.
- ✓ 576 4th-Gen Sparse Systolic Tensor Engines
- ✓ Native FP8/FP4 Micro-Scaling Engine
- ✓ Zero Inter-Chiplet Hop Penalties
3Dx3D Heterogeneous Packaging (TSMC-SoIC + CoWoS-L) 2.5D Advanced Silicon Packaging
Eliminating the memory wall via eight 16-Hi HBM4 3D stacked DRAM cubes across an ultra-wide 16,384-bit bus, delivering 16.0 TB/s unified bandwidth at sub-8ns latency and 0.9 pJ/bit energy efficiency.
- ✓ 16.0 TB/s Sustained Memory Bandwidth
- ✓ Sub-8ns Direct Die-to-Memory Latency
- ✓ 0.9 pJ/bit Ultra-Low Power Envelope
Hyperscale Blade & Cluster Infrastructure
Native PCIe Gen6 x16, CXL 3.1 direct memory pooling, and UCIe 3.0 die-to-die interconnects scaling into 512-MPU direct-liquid-cooled rack systems for trillion-parameter AI foundation models.
- ✓ 128 GB/s Bidirectional PCIe Gen6 x16
- ✓ CXL 3.1 Direct Memory Fabric Pooling
- ✓ 700W Sustained Direct Liquid Cooling
Why FairView Wins vs. Legacy Industry Baselines.
Target comparison at product scale (not measured silicon).
| Feature Vector | FairView Stallion S100 | NVIDIA B200 (Blackwell) | AMD Instinct MI300X |
|---|---|---|---|
| Compute Topology | Target (product family): 185B 2nm-class GAAFET | 2-Die 4nm Multi-Chiplet | 8-Chiplet 5nm/6nm |
| Peak Memory Bandwidth | Target (product family): 16.0 TB/s | 8.0 TB/s | 5.3 TB/s |
| Memory Interface | Target (product family): HBM-class. Not JEDEC / PHY none on this drop. | 8,192-bit Legacy Bus (8-Stack) | 8,192-bit Legacy Bus (8-Stack) |
| Die-to-Memory Latency | Target (product family): < 8 ns | ~28 ns NV-HBI Bridge | ~35 ns Inter-Chiplet |
| I/O Energy Efficiency | Target (product family): 0.9 pJ / bit | 2.4 pJ / bit | 3.1 pJ / bit |
| Thermal Solution | Target (product family): 700W liquid | 1000W - 1200W Extreme | 750W |
| Software Portability | Target software story / host runtime today | CUDA Lock-in | ROCm |
5-Year Realistic Revenue Model (2026–2030).
Illustrative, not a forecast.
| Fiscal Year | Operational Stage | Packaged Sockets | Revenue (USD) | Gross Margin | EBITDA Margin |
|---|---|---|---|---|---|
| 2026 (Y1) | RTL & ZeBu Emulation | 0 (R&D Phase) | $0 | N/A | R&D Phase |
| 2027 (Y2) | First Silicon Delivery | 50 (Alpha Sockets) | $12.5M USD | 52.0% | R&D Phase |
| 2028 (Y3) | Early Commercial Scale | 1,200 Sockets | $95.0M USD | 62.0% | +18.0% |
| 2029 (Y4) | Hyperscale Volume | 6,500 Sockets | $480.0M USD | 66.0% | +36.0% |
| 2030 (Y5) | Global Cloud Scale-Out | 25,000+ Sockets | $1.85B USD | 68.0% | +42.0% |
Bring-up silicon targeted 1H 2027 · Product S10 2H 2027 · Systems 2028.
Shuttle this quarter. Packaged bring-up die 1H 2027. Product S10 2H 2027. Family / systems 2028. Specifications on this page are product-family targets.
Diligence / bring-up: GRID=4; Sky130 fv_mac_pe and fv_secded_byte; GDS, LVS unique, DRC 0; PHY none. Ledger: diligence.
Shuttle booked + freeze
- 01.Entity close.
- 02.Book Sky130 / ChipIgnite-class shuttle. Freeze GRID=4 PE + SRAM + GPIO.
Packaged bring-up silicon
- 01.GRID=4 + G1 SRAM. Boots A1/B1. PHY none. Not the S10 product SKU.
Product-intent S10
- 01.Product S10 + G1 if funding and PD hit. Not N2. Not HBM cubes.
Product-intent follow-on and systems
- 01.Product-intent follow-on and systems if silicon and funding hold.
Access the 2026–2027 Master Pitch Deck.
Contains confidential 5-year financial models, CapEx allocations for the $35M Series A, proprietary IP portfolios, and 2027 silicon tape-out schedules. Access is restricted to verified institutional investors.